Cover of an electronic device having surface ornamentation



The present application is related to co-pending U.S. patent applicationSer. Nos. 29/418,363, 29/418,364, 29/418,365, 29/418,368, 29/418,370,29/418,371, 29/418,372, 29/418,373, 29/418,375, and 29/418,377, each,entitled “Cover of an Electronic Device Having Surface Ornamentation”,by Bin Li. These applications have the same assignee as the presentapplication and have been concurrently filed herewith. Theabove-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device havingsurface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4in FIG. 2.

In FIG. 1-3, the evenly segmented broken lines indicate portions of thecover of an electronic device having surface ornamentation that form nopart of the claimed design. In FIGS. 2 and 4, the unevenly segmentedbroken lines indicate the portion of the design that is shown on anenlarged scale in FIG. 4. The broken lines form no part of the claimeddesign.

CLAIM The ornamental design for a cover of an electronic device havingsurface ornamentation, as shown and described.